Many years ago, Tokusen developed saw wire for the semiconductor industry.  Now, as the demand for solar energy increases, the same technology developed for the demanding requirements of the semiconductor industry has been applied to the solar industry for PV wafer slicing.

As slicing technology improves and the need for lower costs in PV manufacturing increases, we are developing wire diameters as low as 0.050mm for slicing applications. Tokusen is also leading the industry in the development of next generation fixed abrasive (diamond) plated wires.